| 摘要 |
PURPOSE: A magnetron sputtering apparatus is provided to improve the uniformity of thin film deposition by minimizing the distortion of magnetic field. CONSTITUTION: A magnetron sputtering apparatus emits the atom from a target and deposits a thin film on the substrate. The magnetron sputtering apparatus comprises a sputtering unit(300) and a distortion prevention unit(200). The sputtering unit comprises a permanent magnet(310) and a plasma generation unit(600). The permanent magnet is installed on the target. The permanent magnet generates the magnetic field. The plasma generating unit supplies the voltage to an electrode and generates the plasma. The distortion prevention unit prevents the distortion of the magnetic field.
|
