发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REDISTRIBUTION LAYER |
摘要 |
An integrated circuit package system includes forming a first external interconnect having both a first side and a second side that is an opposing side to the first side; forming a first encapsulation around a first integrated circuit and the first external interconnect with the first side, the second side, and the first active side of the first integrated circuit exposed; forming a planar interconnect between the first active side and the second side; forming a second encapsulation covering the planar interconnect and the first active side; connecting a second integrated circuit over the first integrated circuit and the first side; and forming a top encapsulation over the second integrated circuit.
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申请公布号 |
US2010052131(A1) |
申请公布日期 |
2010.03.04 |
申请号 |
US20080198491 |
申请日期 |
2008.08.26 |
申请人 |
TAY LIONEL CHIEN HUI;CAMACHO ZIGMUND RAMIREZ;BATHAN HENRY DESCALZO |
发明人 |
TAY LIONEL CHIEN HUI;CAMACHO ZIGMUND RAMIREZ;BATHAN HENRY DESCALZO |
分类号 |
H01L23/28;H01L23/00 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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