Electronic packaging structure and a manufacturing method thereof

摘要

A packaging structure includes a main substrate having a plurality of circuit lines thereon, and an electronic module having at least one conductive pad at the bottom thereof and having a plurality of conductive lines on the sides thereof. The pad and the conductive circuits are connected electrically to the circuits on the main substrate when the electronic module is disposed on the main substrate. As above-mentioned, one electronic module can be stacked on top of another so that the integrity of the packaging structure is improved.