发明名称 HEAT PUMP-TYPE HOT-WATER SUPPLY DEVICE
摘要 A heat pump-type hot-water supply device includes a heat source-side heat pump unit having a radiation heat exchanger for radiating heat from refrigerant by condensing the refrigerant. The hot-water supply device further includes a hot-water supply unit having a water tank where water is contained, water supply piping for supplying external water into the water tank, water circulation piping communicating with both a bottom section and an upper section of the water tank and circulating water in the bottom section to the upper section of the water tank in a bypassing manner, an absorption heat exchanger located in the middle of the water circulation piping and joined to the radiation heat exchanger of the heat source-side heat pump unit such that the absorption heat exchanger can absorb heat, and a hot-water supply unit for supplying hot water in the upper section of the water tank to the outside. The water supply piping is branched off into a first water supply route and a second water supply route. The first water supply route supplies, without treatment, the water supplied from the outside into the water tank, and the second water supply route supplies the water from the outside into the water tank after improving the quality of the water by a water quality adjustment unit so that the water does not produce scale. Either or both of the water supply routes are used appropriately depending on the quality of water supplied. As a result, scale deposition is suppressed.
申请公布号 KR20100023877(A) 申请公布日期 2010.03.04
申请号 KR20097026269 申请日期 2008.06.25
申请人 DAIKIN INDUSTRIES, LTD. 发明人 NUMATA MITSUHARU;NAKATA HARUO;FURUI SYUUJI;YOSHIDA KAORI
分类号 C02F1/00;C02F5/00;F24H1/00 主分类号 C02F1/00
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