LEAD FRAME, RESIN PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE RESIN PACKAGE

摘要

PURPOSE: A lead frame, a resin package, a semiconductor device and a manufacturing method of the resin package are provided to control the weld formation of a edge part by transmitting a resin material concentrated on the space of an edge part to a resin accumulating part through a redundancy pressure loosing part. CONSTITUTION: A plurality of leads(L2) for a bonding is expanded from an outer frame(F) to an inner side. A die pad(D) is arranged in the inner side of the outer frame. A plurality of connection leads interlinks the outer frame and the die pad. A residual resin accumulating part(H3,H4,H5) is formed in the outer frame. A pressure loosing part(H1,H2) passes through the space between the outer frame and the die pad and the residual resin accumulating part. The surface of the lead frame is blackening-processed.