| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device and method for inspecting a minute structure, capable of easily and accurately inspecting a minute structure having a minute movable part. Ž<P>SOLUTION: The wafer inspection device 1 includes a tester 2, a prober 3, a stage 4, a probe card 5, a magnet 7, a performance board 8, and a test head 9. The probe card 5 includes a probe needle 6. The magnet 7 is provided between the probe card 5 and the test head 9 so as to face a wafer W. A current is applied to the movable part of the minute structure while giving a magnetic field by the magnet 7, whereby a Lorentz force acts vertically to the direction of the magnetic flux and the direction of the current. The movable part of the minute structure is forcedly moved and continuously displaced. Thereafter, the Lorentz force is deadened by interrupting the current, so that the movable part of the minute structure is released from the displaced state and freely vibrated. This can be taken as a step input of the movable part to measure free vibration characteristics. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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