| 发明名称 |
METHOD AND COMPOSITION FOR ELECTRO-CHEMICAL-MECHANICAL POLISHING |
| 摘要 |
Methods and compositions for electro-chemical-mechanical polishing (e-CMP) of silicon chip interconnect materials, such as copper, are provided. The methods include the use of compositions according to the invention in combination with pads having various configurations.
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| 申请公布号 |
US2010051474(A1) |
申请公布日期 |
2010.03.04 |
| 申请号 |
US20090548893 |
申请日期 |
2009.08.27 |
| 申请人 |
ANDRICACOS PANAYOTIS C;ANDRICACOS CALIOPI;CANAPERI DONALD F;COOPER EMANUEL I;COTTE JOHN M;DELIGIANNI HARIKLIA;ECONOMIKOS LAERTIS;EDELSTEIN DANIEL C;FRANZ SILVIA;PRANATHARTHIHARAN BALASUBRAMANIAN;KRISHNAN MAHADEVAIYER;MANSSON ANDREW P;WALTON ERICK G;WEST ALAN C |
发明人 |
ANDRICACOS PANAYOTIS C.;ANDRICACOS CALIOPI;CANAPERI DONALD F.;COOPER EMANUEL I.;COTTE JOHN M.;DELIGIANNI HARIKLIA;ECONOMIKOS LAERTIS;EDELSTEIN DANIEL C.;FRANZ SILVIA;PRANATHARTHIHARAN BALASUBRAMANIAN;KRISHNAN MAHADEVAIYER;MANSSON ANDREW P.;WALTON ERICK G.;WEST ALAN C. |
| 分类号 |
B23H5/06 |
主分类号 |
B23H5/06 |
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