HEAT TRANSFER DEVICE COMPRISING A SEMICONDUCTOR COMPONENT AND CONNECTING DEVICE FOR THE OPERATION THEREOF

摘要

The object for a heat transfer device, in which a first (20) and a second thermally conductive body (30) cool a semiconductor component (12) on both sides, is to fasten the connections required for the operation of the semiconductor component and to be designed in a detachable manner, particularly two electrical connections (70, 80) and a thermal connection, to the heat transfer device using a number of non-positively acting connection elements that is reduced compared to the prior art. In order to achieve the object, according to the invention each thermally conductive body is provided with a continuous recess (24, 34), wherein recesses above an opening (44) in a joining zone, which bonds the thermally conductive bodies opposite of the semiconductor element, communicate with each other, the first thermally conductive body is provided for connecting to a heat sink (90), and the thickness of the second thermally conductive body is limited to a minimum of half the lateral extension of the semiconductor component. For this purpose, the bonded connection (40, 50, 51) of a joining gap comprising the joining zone has a support function that is based on the structure and material. In the connecting device according to the invention for the heat transfer device, at least one or both electrical connections are non-positively fastened to the heat transfer device, together with the non-positive fastening of the heat transfer device to a connecting body, using a non-positively acting connecting element (95), which engages in the connecting body through the recesses in the thermally conductive bodies.