发明名称 RESISTANCE RAM AND MANUFACTURING METHOD OF THE SAME
摘要 <p>PURPOSE: A resistance memory device and a manufacturing method thereof are provided to operate stable switching operation by forming a resistance variable material layer into a structure laminated by a transition metal oxide with an impurity and with no impurity. CONSTITUTION: An active area(14) is formed on a silicon substrate(12) and is defined by an element isolation film(16). A gate electrode(20) and a source/drain region are formed on the active area. A source line(27) is connected to the first source/drain region of a cell transistor. A resistance variable material layer is connected to the second source/drain region of the cell transistor. The resistance variable material layer comprises a doped metal oxide layer and an undoped metal oxide layer. The upper electrode(35) is formed on the resistance variable material layer.</p>
申请公布号 KR20100023610(A) 申请公布日期 2010.03.04
申请号 KR20080082473 申请日期 2008.08.22
申请人 HYNIX SEMICONDUCTOR INC. 发明人 HWANG, YUN TAEK
分类号 H01L27/115;H01L21/8247 主分类号 H01L27/115
代理机构 代理人
主权项
地址