发明名称 FILM THICKNESS MEASURING DEVICE AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide a film thickness measuring method capable of improving the reliability of measuring. SOLUTION: The film thickness measuring method includes: irradiating a light to a substrate to be measured; spectroscopically separate the reflected light from the substrate to be measured; detecting the spectroscopically separated light and outputting a signal according to the intensity of the detected light; calculating the thickness of a thin film based on the error between the output signal and the theoretical waveform; grouping the measurement points; among the measured data at a plurality of the measurement points grouped as the same group, determining a part of them as a measurement error according to at least one side of the thickness of the thin film and the error; and conducting the statistical processing by removing the measurement data determined to be the measurement error from the statistical data for the statistical processing. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010048665(A) 申请公布日期 2010.03.04
申请号 JP20080212966 申请日期 2008.08.21
申请人 MITSUBISHI ELECTRIC CORP 发明人 AOKI OSAMU
分类号 G01B11/06 主分类号 G01B11/06
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