发明名称 |
PROBE CARD COOLING ASSEMBLY WITH DIRECT COOLING OF ACTIVE ELECTRONIC COMPONENTS |
摘要 |
A probe card cooling assembly for use in a test system includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components and at least one coolant port that allows a coolant to enter the high-density package and directly cool the active electronic components of the dies during a testing operation.
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申请公布号 |
US2010052714(A1) |
申请公布日期 |
2010.03.04 |
申请号 |
US20090547260 |
申请日期 |
2009.08.25 |
申请人 |
FORMFACTOR, INC. |
发明人 |
MILLER CHARLES A. |
分类号 |
G01R31/02;G01R1/067;G01R1/073;G01R31/28 |
主分类号 |
G01R31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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