发明名称 SINGLE FOOTPRINT FAMILY OF INTEGRATED POWER MODULES
摘要 <p>A system and method for producing a family of power modules having a common footprint that enables the customer to flexibly choose a power module size without incurring the costs of a relayout of a system design. In one embodiment, the power modules are directed to a point-of-load power controllers.</p>
申请公布号 KR100944114(B1) 申请公布日期 2010.03.02
申请号 KR20070103484 申请日期 2007.10.15
申请人 发明人
分类号 G06F17/50 主分类号 G06F17/50
代理机构 代理人
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