| 摘要 |
[PROBLEMS] To provide a positive photosensitive resin composition which is excellent in electrical insulating properties, heat resistance, mechanical strength, and electrical properties and can form a high-resolution circuit pattern. [MEANS FOR SOLVING PROBLEMS] The positive photosensitive resin composition is characterized by comprising at least one polyhydroxyamide resin (A) having repeating units represented by the formula (1) and having a weight-average molecular weight of 3,000-100,000 and a compound (B) which generates an acid by the action of light. (1) (In the formula, X represents a tetravalent aliphatic or aromatic group; Rand Reach independently represents hydrogen or Calkyl; Arand Areach independently represents an aromatic group; Y represents an organic group comprising an aromatic group substituted by at least one OH group; n is an integer of 1 or larger; and l and m each independently is an integer of 0 or larger, provided that l+m<=2.) |
