发明名称 Test system to test multi-chip package compensating a signal distortion
摘要 A test system includes: a tester; and a test board, on which a multi-chip package including plural memories is mounted, being connected to the tester by way of a transmission line. The transmission line includes a compensation unit for compensating signal distortion.
申请公布号 US7671617(B2) 申请公布日期 2010.03.02
申请号 US20070983110 申请日期 2007.11.07
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SONG KI-JAE
分类号 G01R31/26 主分类号 G01R31/26
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