| 摘要 |
The present invention provides a method and apparatus for hierarchical process control. The method includes accessing at least one first metric indicative of processing performed on a wafer by a plurality of tool groups. The method also includes providing at least one tool group parameter to each of the plurality of tool groups based on the at least one first metric and accessing a plurality of second metrics. Each second metric is associated with a corresponding one of the plurality of tool groups and is indicative of processing performed on the wafer by the plurality of tools in the corresponding tool group. The method further includes providing at least one tool parameter to at least one tool in each of the plurality of tool groups based on the second metric associated with the tool group and the at least one tool group parameter provided to the tool group.
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