TAPE WIRING SUBSTRATE, CHIP ON FILM PACKAGE AND DEVICE ASSEMBLY INCLUDING THE SAME

摘要

PURPOSE: A tape wiring substrate, a chip-on-film package, and a device assembly are provided to reduce a size and a weight of an electronic product and implement high integration. CONSTITUTION: A tape wiring substrate includes an insulation film substrate(10), a first metal pattern layer(20A), a second metal pattern layer(30A). The insulation film substrate includes a first main surface(11) and a second main surface(12) with one chip mounting region. One via or more are included between the first main surface and the second main surface. The plurality of first metal pattern layers are provided on the first main surface. The plurality of metal pattern layers are provided on the second main surface. The plurality of second metal pattern layers are provided on the second main surface and are electrically connected to the first pattern layer through a via.