| 摘要 |
A semiconductor device includes: a first semiconductor element; a second semiconductor element mounted on an upper surface of the first semiconductor element via an adhesive layer; a mold resin body for overmolding the first semiconductor element and the second semiconductor element; and a first spherical filler having a diameter smaller than an average thickness of the adhesive layer and a second spherical filler having a diameter larger than the average thickness of the adhesive layer, the first or second spherical filler being dispersed in the mold resin body. The mold resin body does not contain a spherical filler which has a diameter substantially equal to the average thickness of the adhesive layer.
|
