发明名称 |
POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN |
摘要 |
A positive resist composition including: a base component (A) which exhibits increased solubility in an alkali developing solution under the action of acid; and an acid-generator component (B) which generates acid upon exposure; dissolved in an organic solvent (S), the organic solvent (S) including an alcohol-based organic solvent having a boiling point of at least 150° C.; and a method of forming a resist pattern including: applying the positive resist composition on a substrate on which a first resist pattern is formed to form a second resist film; and subjecting the second resist film to selective exposure and alkali developing to form a resist pattern.
|
申请公布号 |
US2010047724(A1) |
申请公布日期 |
2010.02.25 |
申请号 |
US20090534735 |
申请日期 |
2009.08.03 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
TAKESHITA MASARU;KUMADA SHINJI;YOSHII YASUHIRO;IWAI TAKESHI;NAKAMURA TSUYOSHI |
分类号 |
G03C1/053;G03C1/00;G03F7/00 |
主分类号 |
G03C1/053 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|