ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

摘要

Provided is an electronic component wherein a highly reliable airtight sealing structure can be obtained in a short time. A first sealing frame (16) formed on a main substrate (12) and a second sealing frame (19) formed on a cover substrate (13) are both composed of an Ni film.  For instance, a Bi layer (26) is formed on the first sealing frame, and a bonding section (24) which bonds the first sealing frame and the second sealing frame to each other is formed by heating the first sealing frame and the second sealing frame at a temperature of, for instance, 300°C for at least 10 seconds, while pressurizing the frames in a direction wherein the frames are brought close to each other.  The bonding section is composed of an Ni-Bi alloy, and when NiBi3 is generated at an initial stage of a heating/bonding step and then the heating/bonding step is continued, diffusion between NiBi3 and Ni is advanced to form NiBi as a whole.  When the bonding section is composed of NiBi, the bonding section is permitted to be highly durable against plastic fatigue failure caused by repeating stress.