LASER PROCESSING APPARATUS AND METHOD

摘要

PROBLEM TO BE SOLVED: To provide a laser processing apparatus and a laser processing method for correctly processing a groove in a substrate by correcting errors of the position of the groove when processing the groove on the substrate.

SOLUTION: The laser processing apparatus includes: a stage device moving a substrate having a plurality of work sections along longitudinal and lateral axes and rotating the substrate at a predetermined angle about a rotational axis; a laser beam oscillating device oscillating laser beams to process a groove in the substrate; a scanner device reflecting the laser beam so that the laser beam is applied to each working section at the processing location where the groove is processed; a camera device picking up an image of each working section and providing the picked-up image; and a control portion correcting a processing location data using the picked-up image to allow the laser oscillating device and the scanner device to process the groove in the substrate.

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