| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus that simultaneously feeds many small semiconductor chips at a desired location on a mounting substrate, at low cost. SOLUTION: A liquid drop feed apparatus is provided , consisting of a liquid drop feed substrate 10 that feeds liquid drops 15, including a semiconductor chip 50; a voltage controller 16 for feeding liquid drops and a voltage controller 17 for precharging that control a voltage to be applied to the liquid drop feed substrate 10; and a system apparatus 19, that outputs a controlling signal to the voltage controller 16 for feeding liquid drops and the voltage controller 17 for precharging. COPYRIGHT: (C)2010,JPO&INPIT |
