发明名称 Enhanced Thermal Management for Improved Module Reliability
摘要 Mitigating effects of delamination of components in the data processing system is provided. A signal is received from one or more sensors in the data processing system. A determination is made as to whether the signal indicates that one threshold in a plurality of thresholds has been reached or exceeded. Responsive to the signal indicating that one threshold in the plurality of thresholds has been reached or exceeded, a determination is made as to whether the one threshold is a low temperature threshold or a high temperature threshold. Responsive to the one threshold being a low temperature threshold, one of a plurality of actions is initiated to increase a temperature of the data processing system thereby mitigating effects of delamination of the components in the data processing system.
申请公布号 US2010049995(A1) 申请公布日期 2010.02.25
申请号 US20080194620 申请日期 2008.08.20
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CASEY JON A.;FLOYD MICHAEL S.;GHIASI SORAYA;MARSTON KENNETH C.;MUNCY JENNIFER V.;WARE MALCOLM S.;WEEKLY ROGER D.
分类号 G06F1/00 主分类号 G06F1/00
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