发明名称 |
SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD |
摘要 |
A substrate treatment apparatus for treating a substrate on which a plurality of patterns are formed adjacently, has a first chamber which has resistance to a chemical and cleans the substrate with the chemical; a second chamber which is disposed above or below the first chamber, has higher pressure resistance than the first chamber, and supercritically dries the substrate; and a gate unit which is provided between the first and second chambers and can be opened/closed.
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申请公布号 |
US2010044343(A1) |
申请公布日期 |
2010.02.25 |
申请号 |
US20090545541 |
申请日期 |
2009.08.21 |
申请人 |
TOMITA HIROSHI;JI LINAN;OKUCHI HISASHI;KOIDE TATSUHIKO;IIMORI HIROYASU;HAYASHI HIDEKAZU |
发明人 |
TOMITA HIROSHI;JI LINAN;OKUCHI HISASHI;KOIDE TATSUHIKO;IIMORI HIROYASU;HAYASHI HIDEKAZU |
分类号 |
C03C15/00 |
主分类号 |
C03C15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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