| 摘要 |
<P>PROBLEM TO BE SOLVED: To ready and grasp and manage, without fail, the number of contacts of a test needle in semiconductor chip units with a configuration, as simple as possible, without additionally using any large-scale devices, and thereby to reduce the manufacturing cost and time. Ž<P>SOLUTION: A plurality of fuses 13, namely, storage sections for storing the number of contacts, where a probing needle abuts against a first electrode pad 11, and the number of tests corresponding to each of semiconductor chips 2, are provided on a scribe region 3. Then a plurality of second electrode pads 12, which read and write the number of contacts and the number of tests to the fuses 13, are provided on the semiconductor chip 2 adjacent to the first electrode pad 11. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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