发明名称 |
INTEGRATED CIRCUIT PACKAGE EMPLOYING PREDETERMINED THREE-DIMENSIONAL SOLDER PAD SURFACE AND METHOD FOR MAKING SAME |
摘要 |
An integrated circuit package employs a solder pad that includes a predetermined three dimensional surface that is adapted to receive solder. In one example, the predetermined three dimensional surface includes at least one predetermined hill or protruding portion and a valley portion, such as a lower portion, having a predetermined relative height between the hill portion and a valley portion. The predetermined three dimensional surface can be configured in any suitable configuration and may include contoured patterns, non-patterns, or any other suitable configuration as desired. A related method is also described. |
申请公布号 |
WO2010020033(A1) |
申请公布日期 |
2010.02.25 |
申请号 |
WO2009CA01086 |
申请日期 |
2009.07.31 |
申请人 |
ATI TECHNOLOGIES ULC;ZBRZEZNY, ADAM R.;TOPACIO, RODEN R. |
发明人 |
ZBRZEZNY, ADAM R.;TOPACIO, RODEN R. |
分类号 |
H01L23/488;H01L21/77;H01L23/50 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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