| 发明名称 |
ADHESIVE SHEET FOR PRODUCING A SEMICONDUCTOR DEVICE, AND A METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE USING THE SAME |
| 摘要 |
The present invention relates to an adhesive sheet for producing a semiconductor device, which is used when a semiconductor element is caused to adhere onto an adherend and the semiconductor element is wire-bonded, in which a lipophilic lamellar clay mineral is contained.
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| 申请公布号 |
US2010047968(A1) |
申请公布日期 |
2010.02.25 |
| 申请号 |
US20070519510 |
申请日期 |
2007.12.13 |
| 申请人 |
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发明人 |
AMANO YASUHIRO;TERADA YOSHIO;TAKAMOTO NAOHIDE |
| 分类号 |
H01L21/78;B32B5/16;C08K3/36 |
主分类号 |
H01L21/78 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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