METHOD FOR MANUFACTURING MICRO-CHANNEL CHIP, DIE FOR MOLDING MICRO-CHANNEL CHIP, AND MICRO-CHANNEL CHIP

摘要

A die (100) is provided with: a cavity which can contain a molten resin; a fine structure (102) provided on a molding transfer surface (101) forming the cavity such that the fine structure protrudes to the cavity side from the molding transfer surface (101); and a counter-shrinkage protruding section (103) protruding higher than the fine structure (102) to the cavity side from one surface.  A molten resin is applied to the die (100) and the surface of the die is relatively removed in the order of the fine structure (102) and the counter-shrinkage protruding section (103) from a resin substrate (001) formed by solidifying the resin.