发明名称 POLYOLEFIN RESIN LAMINATED FOAM
摘要 PROBLEM TO BE SOLVED: To provide a polyolefin resin laminated foam which is suitable as a packaging material for precision electronic instruments such as electronic products, precision instruments, circuit boards, silicon semiconductors, and glass substrates for displaying, and can provide an excellent cleaning performance when contaminants on the surface of the precision electronic instrument are cleaned by washing with water, wiping with a water-containing cloth, or the like, even when foreign substances are transferred on the precision electronic instrument. SOLUTION: In the polyolefin resin laminated foam obtained by laminating a polyolefin resin layer on at least one surface of a polyolefin resin foam layer, at least one hydrophilic compound selected from polyalkylene oxides and surfactants with a hydrophilic lipophilic balance (HLB value) of≥8 is added in the polyolefin resin layer at a ratio of 0.5-20 pts.wt. based on 100 pts.wt. of polyolefin resin composing the resin layer, and the hydrophilic compound is not substantially added in the polyolefin resin foam layer. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010042556(A) 申请公布日期 2010.02.25
申请号 JP20080207131 申请日期 2008.08.11
申请人 JSP CORP 发明人 ISHIKAWA KOICHI;AOKI TAKESHI;NISHIMOTO TAKASHI;MUROI TAKASHI;IWASAKI SATOSHI
分类号 B32B27/32;B29C47/06;B29K23/00;B29K105/04;B29L9/00;B32B5/18 主分类号 B32B27/32
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