| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that shortens a time of exposure of a substrate surface to a high-humidity oxygen atmosphere. Ž<P>SOLUTION: A plurality of N<SB>2</SB>gas chambers 12 are disposed in an indexer section. The N<SB>2</SB>gas chambers 12 each includes an opposite member 16 fixed to a top plate 13 and a plurality of lift pins 17 for elevating and lowering the substrate W from and to the opposite member 16. One center portion discharge opening 21 and a plurality of peripheral portion discharge openings 22 are provided on a substrate opposite surface 20 of the opposite member 16. An N<SB>2</SB>gas discharged from the discharge openings 21 and 22 is supplied to between the surface of the substrate W and the substrate opposite surface 20. In this invention, the part between the surface of the substrate W and the substrate opposite surface 20 is filled with the N<SB>2</SB>gas. Consequently, the surface of the substrate W is shielded from the high-humidity oxygen atmosphere in the indexer section. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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