发明名称 |
BONDING APPARATUS FOR PRINTHEADS |
摘要 |
The invention relates to a bonding apparatus for bonding a carrier sheet used for carrying printhead integrated circuits to a carrier base. The apparatus includes a support assembly configured to receive and support the carrier base, and a lamination head arranged on the support assembly and configured to bond the carrier sheet to the carrier base. Further included are a conformal material supply mechanism arranged on the support assembly and configured to interpose a conformal material between the surface and the head prior to bonding, and a controller to control operation of the lamination head and the supply mechanism to facilitate bonding of the carrier sheet to the carrier base.
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申请公布号 |
US2010043979(A1) |
申请公布日期 |
2010.02.25 |
申请号 |
US20080193732 |
申请日期 |
2008.08.19 |
申请人 |
SILVERBROOK RESEARCH PTY LTD |
发明人 |
SLEIJPEN STEPHEN JOHN;ANDREW JAMES;BOWYER GRAEME KENNETH;GRANGER WILLIAM;WASZCZUK JAN;BURKE DAVID OLIVER;STRUDWICKE CRAIG DONALD;THELANDER JASON MARK |
分类号 |
B32B37/00 |
主分类号 |
B32B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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