| 发明名称 |
ALLOY NANOPARTICLE, METHOD FOR PRODUCTION THEREOF, AND INK AND PASTE USING THE ALLOY NANOPARTICLE |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide Sn-Cu-Ag alloy nanoparticles, a method for production thereof, and ink and paste using the alloy nanoparticles. <P>SOLUTION: The alloy nanoparticles include, by weight, >95% to≤99.9% of Sn and≥0.1% and <5% of at least one metal selected from the group consisting of Ag and Cu. The nanoparticles can be variedly applied to the fields such as metal ink having excellent electrical conductivity or solder materials having low calcinating temperature. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
| 申请公布号 |
JP2010043350(A) |
申请公布日期 |
2010.02.25 |
| 申请号 |
JP20090120508 |
申请日期 |
2009.05.19 |
| 申请人 |
SAMSUNG ELECTRO MECHANICS CO LTD |
发明人 |
LEE KWI JONG;LEE HYUCK-MO;SONG HYUN-JOON;JO YUN-HWAN;PARK JI-CHAN;BANG JUNG-UP;KIM DONG-HOON |
| 分类号 |
B22F1/00;B22F9/00;B22F9/24;B23K35/22;B23K35/26;C09D11/00;C09D11/52;C22C13/00;H01B1/22;H01B5/00;H01B13/00 |
主分类号 |
B22F1/00 |
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