发明名称 METHOD AND DISPERSION FOR APPLYING A METAL LAYER TO A SUBSTRATE AND METALLIZABLE THERMOPLASTIC MOLDING COMPOUND
摘要 The invention relates to a method for applying a metal layer to a substrate by deposition of a metal from a metallic salt solution, characterized in that the substrate surface comprises exfoliated graphite.
申请公布号 WO2009112573(A3) 申请公布日期 2010.02.25
申请号 WO2009EP52990 申请日期 2009.03.13
申请人 BASF SE;HERMES, STEPHAN;JOSHI, KETAN;WAGNER, NORBERT;KIEBURG, CHRISTOFFER 发明人 HERMES, STEPHAN;JOSHI, KETAN;WAGNER, NORBERT;KIEBURG, CHRISTOFFER
分类号 C23C18/54;C23C18/16 主分类号 C23C18/54
代理机构 代理人
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