发明名称 |
Tracking Thermal Mini-Cycle Stress |
摘要 |
Monitoring temperature excursions an assembly experiences over a life of the assembly is provided. A determination is made as to whether the assembly has been in service beyond a predetermined end of life objective. Responsive to the assembly failing to be in service beyond the predetermined end of life objective, a new temperature value associated with the assembly is read. A modifier value for a figure of merit (FOM) value is computed and added to a cumulative figure of merit value. The cumulative figure of merit value is compared to a cumulative stress figure of merit budget. Responsive to the cumulative figure of merit value exceeding the cumulative stress figure of merit budget, an identified stress management solution is implemented.
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申请公布号 |
US2010049466(A1) |
申请公布日期 |
2010.02.25 |
申请号 |
US20080194606 |
申请日期 |
2008.08.20 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CASEY JON A.;FLOYD MICHAEL S.;GHIASI SORAYA;MARSTON KENNETH C.;MUNCY JENNIFER V.;WARE MALCOM S.;WEEKLY ROGER D. |
分类号 |
G06F17/00;G08B1/08 |
主分类号 |
G06F17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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