发明名称 Integrated circuit comprising at least one capacitor and process for forming the capacitor
摘要 An integrated circuit includes at least one capacitor that is formed on a layer provided with at least one first trench. The capacitor, which is provided with a dielectric layer that separates two electrodes, conforms to the shape of the first trench, but leaves a part of the first trench unfilled. A material capable of absorbing stresses associated with the displacements of the walls of the trench is placed in the trench to fill the part of the first trench. A second trench is formed at least partly surrounding the first trench. This second trench is also at least partly filled with a material capable of absorbing stresses associated with the displacements of the walls of the second trench. A void may be included in the stress absorbing material which fills either of the first or second trenches.
申请公布号 US7667292(B2) 申请公布日期 2010.02.23
申请号 US20060415393 申请日期 2006.05.01
申请人 STMICROELECTRONICS S.A.;STMICROELECTRONICS (CROLLES 2) SAS 发明人 GIRAUDIN JEAN-CHRISTOPHE;FIORI VINCENT;DELPECH PHILIPPE
分类号 H01L27/08 主分类号 H01L27/08
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