| 摘要 |
PURPOSE: A method of forming substrate structure and a method of manufacturing device comprising the same are provided to form a wiring having a superior electrical characteristic and mechanical property by forming an insulating material, a semiconductor material, or a metal material within the concave part. CONSTITUTION: A first material layer is formed on the substrate(1) having a concave part(2). A first material layer is eliminated from a substrate excluding the concave part by using a second material reacting to a first material. The deposition film(40) is formed from the first material by using third material reacting to the first material. A time when the second material is exposed is adjusted so that the concave part is not exposed from the second material.
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