| 摘要 |
<p>A multilayer laminated circuit board (1) having a laminate structure wherein resin films (100) and circuit layers (200) are alternately laminated. The resin films (100) are obtained by processing a long film and have one or more multiple conduction parts (110) each of which has two or more conduction vias (120) occupying a region having a diameter of not less than 10 µm but not more than 3000 µm. Each conduction via (120) has an inner diameter of not less than 5 µm but not more than 300 µm, and when the thickness of the resin films (100) is represented by T and the inner diameter of the conduction vias (120) is represented by d, T and d satisfy the following relation: 0.3 = d/T = 2. Metal circuits (50) contained in the circuit layers (200) are formed on the resin films (100) and within the conduction vias (120), and each metal circuit (50) is composed of a base layer (130) and a plating layer (140) formed on the base layer (130) by electroplating. A component and a product each using the multilayer laminated circuit board are also disclosed.</p> |
