| 摘要 |
<p>Provided is a semiconductor processing method wherein cleaning is not required even when an outer circumferential edge (3) of a semiconductor wafer (1) is contaminated due to processing, the outer circumferential edge (3) of the semiconductor wafer (1) is protected from corrosion and shocks from the external, and furthermore, the semiconductor wafer can be coated with electroless nickel plating. The semiconductor processing method includes a step of attaching an adhesive tape (4) onto the outer circumferential edge (3) of the semiconductor wafer (1) at the time of processing the semiconductor wafer (1), and a step of removing the adhesive tape (4) from the semiconductor wafer (1). Furthermore, the adhesive tape (4) to be used in such method is also provided, and an adhesive of the adhesive tape (4) contains an acrylic component and a silicone component.</p> |
