| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an aqueous dispersing element for chemical mechanical polishing, suitably used for forming the circuit board provided with a wiring layer including copper or copper alloy in a resin substrate, with high speed to polish the copper or copper alloy, excellent step eliminating property and excellent flatness of the obtained circuit board. <P>SOLUTION: The aqueous dispersing element is used for forming the circuit board provided with the wiring layer including copper or copper alloy in the resin substrate. The aqueous dispersing element contains (A) organic acid, (B) nitrogen-containing heterocyclic compound, (C) oxidant, (D1) first abrasive grain having a primary particle size of 20 to 70 nm and (D2) second abrasive grain having a primary particle size of 80 to 150 nm. Concentration of the (A) organic acid with respect to the aqueous dispersing element is 3 to 15 mass%, a ratio (N1/N2) of a particle number N1 of (D1) the first abrasive grain to a particle number N2 of (D2) the second abrasive grain is 3 to 50, and a pH value is 1 to 5. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
