| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for manufacturing a semiconductor device, which are used for mounting semiconductor chips or wiring members with high accuracy. <P>SOLUTION: The semiconductor device manufacturing apparatus includes: a mount on which first and second semiconductor chips are mounted on a mounting member; a collet that picks up each of the semiconductor chips; a first imaging section that images the second semiconductor chip before mounting; a second imaging section that images a position at which the second semiconductor chip is to be mounted on the mounting member and the first semiconductor chip mounted on the mounting member in the same field of view; an image processor that detects first positional data of the second semiconductor chip on the basis of the image taken by the first imaging section, and second positional data of the position and third positional data of the first semiconductor chip after mounting on the basis of the image taken by the second imaging section; and a control section that controls the mount and the collet by using the first, second, and third positional data. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
