| 摘要 |
An electromagnetic coupling module includes a feed circuit substrate having external coupling electrodes on both main surfaces thereof and a wireless IC chip. Radiation electrodes are disposed on a packaging body. The electromagnetic coupling module is disposed on a joint of the packaging body so that the external coupling electrodes on both the main surfaces of the electromagnetic coupling module are coupled to the radiation electrodes, respectively. Thus, the wireless IC device is resistant to shock, stress, forces or the like, easy to manufacture, obtains stable characteristics and allows for easy reuse or replacement of an IC chip.
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