发明名称 BONDING METHOD, JUNCTION STRUCTURE, DROPLET DISCHARGE HEAD AND DROPLET DISCHARGING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a bonding method wherein two members can be bonded firmly with a high dimensional accuracy selectively in one region of a bonding surface while can be preventing a not bonded region from contamination by the constituent of a bonding film, a junction structure wherein two members are mutually bonded firmly with a high dimensional accuracy selectively in one region of the bonding surface, a liquid drop discharging head high in reliability and equipped with such a junction body and provide a liquid droplet discharging device equipped with such the liquid drop discharging head. Ž<P>SOLUTION: The bonding method includes a process for forming a resist film 4 in one region 201 of a part on the bonding surface 200 of a first substrate 2, a process for forming a film of plasma polymerization film 3' on the whole body of the bonding surface 200 through plasma polymerization method, a process for obtaining a bonding film 3 through patterning of a plasma polymerization film 3' through lift-off method after removing the resist film 4, a process for giving energy to the bonding film 3 and a process for bonding the bonding film 3 to the second substrate 5 (body to be bonded) so that they are adhered closely. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010040877(A) 申请公布日期 2010.02.18
申请号 JP20080203580 申请日期 2008.08.06
申请人 SEIKO EPSON CORP 发明人 WAKAMATSU KOSUKE
分类号 H01L21/02 主分类号 H01L21/02
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