| 摘要 |
PROBLEM TO BE SOLVED: To maintain the quality of plating processing by computing concentrations of components contained in a plating liquid and suitably adjusting the plating liquid. SOLUTION: A method for manufacturing a semiconductor device includes: a step of adding one or a plurality of additives to the plating liquid and performing plating processing on a semiconductor wafer (step S1); a step of measuring one or a plurality of parameters showing the processing state of the plating processing (step S3); a step of computing the concentrations of components contained in the plating liquid from the parameters (step S4); and a step of performing adjustment processing on the plating liquid, so that the computed concentrations of the components are equal to or less than predetermined thresholds (step S6). COPYRIGHT: (C)2010,JPO&INPIT |
