发明名称 |
Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil |
摘要 |
It is an object of the present invention to provide an electrodeposited copper foil which has a lower profile and a higher gloss than low-profile electrodeposited copper foil conventionally supplied in markets. For achieving this object, the present invention employs an electrodeposited copper foil which has a super low profile, the surface roughness (Rzjis) of the deposit side of lower than 1.0-micron meter, and the gloss [Gs(60-deg.)] thereof of not lower than 400 irrespective to its thickness. The present invention also provides a manufacturing method of an electrodeposited copper foil obtained by electrodeposition using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid and/or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine.
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申请公布号 |
US2010038115(A1) |
申请公布日期 |
2010.02.18 |
申请号 |
US20060910050 |
申请日期 |
2006.03.31 |
申请人 |
MITSUI MINING & SMELTING CO., LTD |
发明人 |
MATSUDA MITSUYOSHI;SAKAI HISAO;TOMONAGA SAKITO;DOBASHI MAKOTO |
分类号 |
H05K1/00;C25D1/04;C25D7/00;H05K1/09 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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