| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-reliability manufacturing method of a wiring board capable of normally operating loaded electronic components, at all times, without a decline of electric insulation of wiring conductors with each other due to infiltration of moisture, even if it is used over long periods of time, under an environment of high humidity and high temperature. SOLUTION: A laminate 20 for the wiring board is formed, by alternately stacking a plurality of prepregs 1P formed by impregnating a non-cured thermosetting resin composition comprising thermosetting resin; a bridge material and a polymerization initiator in a heat-resistant fiber base material; and the wiring conductors 3 comprising metal. After the laminate 20 is held for a prescribed time, at a temperature between the flow beginning temperature of the thermosetting resin composition to the 10-hour half-life temperature of the polymerization initiator, the laminate 20 is cured at a temperature equal to or higher than the 1-minute half-life temperature of the polymerization initiator, while pressure between 5 to 10 MPa is applied. Then, the laminate 20 is cooled to a temperature which is equal to or below the glass dislocation point of the thermosetting resin composition, while the low pressure of 0.1 to 1 MPa is applied, and the wiring board is manufactured. COPYRIGHT: (C)2010,JPO&INPIT |
