| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated type ceramic electronic component manufacturing method avoiding mutual adhesion of laminated chips after cutting in the cutting step of cutting a laminated plate into the form of a grid to obtain the laminated chip corresponding to a component body. Ž<P>SOLUTION: A first sheet S11 is formed by (1) the step of applying a ceramic slurry to have a predetermined thickness on the surface of a base film and drying it to form a ceramic green sheet as a unbaked ceramic layer 11, (2) the step of printing a conductor paste of a predetermined thickness on the surface of the ceramic green sheet in a matrix of x-directional rows and y-directional columns and drying it to form a group of unbaked conductor layers 12 and (3) the step of printing a ceramic paste of a predetermined thickness on the surface of the ceramic green sheet with the group of the unbaked conductor layers 12 formed so as to surround each unbaked conductor layer 12 via a gap 13a and to keep away from x-directional and y-directional lines to be cut and drying it to form a step absorbing unbaked ceramic layer 13 of almost the same thickness as that of each unbaked conductor layer 12. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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