发明名称 SELF-ALIGNED BORDERLESS CONTACTS FOR HIGH DENSITY ELECTRONIC AND MEMORY DEVICE INTEGRATION
摘要 A method for fabricating a transistor having self-aligned borderless electrical contacts is disclosed. A gate stack is formed on a silicon region. An off-set spacer is formed surrounding the gate stack. A sacrificial layer that includes a carbon-based film is deposited overlying the silicon region, the gate stack, and the off-set spacer. A pattern is defined in the sacrificial layer to define a contact area for the electrical contact. The pattern exposes at least a portion of the gate stack and source/drain. A dielectric layer is deposited overlying the sacrificial layer that has been patterned and the portion of the gate stack that has been exposed. The sacrificial layer that has been patterned is selectively removed to define the contact area at the height that has been defined. The contact area for the height that has been defined is metalized to form the electrical contact.
申请公布号 US2010038723(A1) 申请公布日期 2010.02.18
申请号 US20080193339 申请日期 2008.08.18
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BABICH KATHERINA E.;CHANG JOSEPHINE B.;FULLER NICHOLAS C.;GUILLORN MICHAEL A.;LAUER ISAAC;ROOKS MICHAEL J.
分类号 H01L29/00;H01L21/20 主分类号 H01L29/00
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