| 摘要 |
[PROBLEMS]To provide a wafer supporting glass consisting of a glass plate (GP) exhibiting flexibility so that it can support a semiconductor wafer (SW) by bonding thereto and can be stripped therefrom.[MEANS FOR SOLVING PROBLEMS]The glass plate (GP) is a wafer supporting glass for supporting a semiconductor wafer (SW) by bonding thereto. In order to strip the wafer supporting glass bonded to the semiconductor wafer (SW), the wafer supporting glass bends by a predetermined angle or more. When the wafer supporting glass bends 30 degrees or more, it can be stripped without applying a large force to the semiconductor wafer. |
