ELECTROPLATING APPARTUS AND TRIVALENT CHROMIUM ALLOY ELECTROPLATING SOLUTION FOR AMORPHOUS TRIVALENT CHROMIUM ALLOY ELECTROPLATING LAYER

摘要

PURPOSE: A plating device for forming an amorphous trivalent chromium alloy plating layer and amorphous trivalent chromium alloy plating solution for the same are provided to reduce raw material cost and improve efficiency. CONSTITUTION: A plating device comprises a square drum-shaped electroplating bath(10), an ion diaphragm(20), a diaphragm(30), a rectifier(40), trivalent chrome alloy plating solution(50), and dilute sulfuric acid solution(60). A cathode ray(11) is interlinked to a substrate(12) forming a copper-electroplated layer on the inner center of the electroplating bath. An insoluble anode(14) interlinks to an anode ray(13) on the outside of the electroplating bath. The dilute sulfuric acid solution and ion pass through the ion diaphragm which is divided into a cathode(10a) and an anode(10b). The diaphragm is formed on the both sides of the ion diaphragm and supports the ion diaphragm. The rectifier is connected to the cathode ray and the anode ray and supplies electricity.