| 发明名称 |
ELECTRONIC DEVICE HAVING A MULTI-LAYER WIRING STRUCTURE |
| 摘要 |
An electronic device having a multi-layer wiring structure comprises an inorganic resin material film as an interlayer insulation film (14) between a lower wiring (13) and an upper wiring (15), an organic insulative material film such as polymide as a protection film (17a, 17b) for protecting an uppermost wiring and resin mold (19) for molding the electronic device. |
| 申请公布号 |
EP0122631(A3) |
申请公布日期 |
1986.09.10 |
| 申请号 |
EP19840104298 |
申请日期 |
1984.04.16 |
| 申请人 |
HITACHI, LTD.;HITACHI MICROCOMPUTER ENGINEERING LTD. |
发明人 |
FUJIOKA, KAZUMICHI;KATO, TOKIO;TAKAHASHI, EIICHI |
| 分类号 |
H01L21/768;H01L21/312;H01L23/31;H01L23/522;H01L23/532 |
主分类号 |
H01L21/768 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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