| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device including a structure for improving image quality. Ž<P>SOLUTION: The semiconductor device includes a semiconductor substrate 4 having an imaging region 3 formed on a main surface and a peripheral circuit region 2 arranged on an outer circumference of the imaging region 3, a transparent substrate 5 formed on the imaging region 3, a sealing region 15 for sealing above the peripheral circuit region 2 on the semiconductor substrate 4, and a parasitic capacity shielding film 24 formed between a part covering the peripheral circuit region 2 of the sealing resin 15, and the peripheral circuit region 2. The parasitic capacity shielding film 24 is electrically connected to a ground of the peripheral circuit region 2. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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